Hewlett Packard Enterprise RP001227412 memory module 8 GB DDR3 1024 The new arrangement allows the

The new arrangement allows the liquid crystals to turn faster for a faster response time

The Snapdragon 695 5G Mobile Platform brings you the performance you need in a modern smartphone with the extra benefit of high-speed 5G data speeds

28 kg Height (without stand) 349 mm Depth (without stand) 55 mm Width (without stand) 532 mm Weight (with stand) 6

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Hewlett Packard Enterprise RP001227412 memory module 8 GB DDR3 1024 The new arrangement allows theHewlett Packard Enterprise RP001227412 memory module 8 GB DDR3 Key Features Internal Memory Type : DDR3 Memory Clock Speed: Memory Form Factor : 240 pin DIMM Component For : PC Server Internal Memory : 8 Memory Layout (modules x size) : Overview "